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-rw-r--r--hw_sim/NOTES.md2
1 files changed, 1 insertions, 1 deletions
diff --git a/hw_sim/NOTES.md b/hw_sim/NOTES.md
index 70cf1e6..c028783 100644
--- a/hw_sim/NOTES.md
+++ b/hw_sim/NOTES.md
@@ -91,7 +91,7 @@ JLC PCB + SMT assembly for everything; SOCKET the screened gray-market MDACs (DI
test points, jumpers, isolatable single-column bring-up region (first board runs Stage-1 gates
on one column). First-article batch of 5 before volume. Hand-soldering is not an option at T64
scale (2,250 x 20 pins); even the $300 MVP goes JLC economy so identical boards can ship to
-Dillavou/Sam. Toolchain endpoint: SKiDL -> KiCad -> scripted Gerber+BOM+CPL = JLC-ready order
+Sam Dillavou's lab. Toolchain endpoint: SKiDL -> KiCad -> scripted Gerber+BOM+CPL = JLC-ready order
package from the same simulated source. SPICE pre-verification (v0/v1/v1.1/Stage-C) exists to
hold respins to 1-2 x 1-2 weeks. Bonus: machine-assembled layout parasitics are REPRODUCIBLE,
narrowing the 1-3x wiring band in the settle/energy ledgers.